IPDIA
IPDIA is a spin-out from NXP, a leading European semiconductor company, which itself is a 2006 spin-out from Philips. With its patented and leading PICS technology, IPDIA integrates up to hundreds of passive components (resistors, capacitors, inductors and diodes, present in any electronic circuit) in a single silicon die, creating an Integrated Passive Device (IPD).
IPDIA produces both stand-alone IPDs as well as Systems-In-Package (SiP). The stand-alone IPDs are used in LEDs and modem cards. In SiPs the IPD and the chip are integrated leading to better performance, a smaller footprint (10 x smaller), and a lower cost price.
The SiP technology opens up numerous commercial applications across industries like medical devices, aerospace and defense, and meets the ongoing requirements of many OEMs to keep on reducing the size of electronic devices while improving their performance and reliability.
IPDIA is based in Caen (France) where it has its own manufacturing site.